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JYS - SMD Multilayer Ceramic Chip Capacitor

jb Capacitors Company designs and manufactures Multilayer (mono) Axial & Radial Ceramic Capacitors. Following are JYS - SMD Multilayer Ceramic Chip Capacitor features, applications, specifications and dimensions. We supply high quality Multilayer (mono) Axial & Radial Ceramic Capacitors to you.

JYS - SMD Multilayer Ceramic Chip Capacitor Features

  • related IC’s needs of the wireless/portable systems.
  • Lower profile, lower loss and higher Current in Compact Size is the design guide of our principles to design such inductors which made by unique automatic process.
  • Industry standard size and various load spacing available.

JYS - SMD Multilayer Ceramic Chip Capacitor Applications

•Consumer Electronics, , Power Management, Industrial, Medical
• High-frequency applications including mobile phones, Portable Devices,Bluetooth
• GSM, CDMA, PDC

JYS - SMD Multilayer Ceramic Chip Capacitor Parameters PDF

JYS - SMD Multilayer Ceramic Chip Capacitor Specifications

Dielectris & Values NPO X7R X5R Y5V Z5U consult product pages of catalog for cap ranges and voltage rating JYS-Multilayer-Ceramic-Capacitor-SMD
Terminations Tin / Nickel
Voltage 16, 25, 50, 63 VDC
Capacitance 0.5pF ~ 10uF
Tolerance ±0.1pF ~ +80-20%
Operating Temperature Range NPO: -55 ~ +125℃;X7R: -55 ~ +125℃;X5R: -55~85°C; Y5V: -30 ~ +85℃

JYS - SMD Multilayer Ceramic Chip Capacitor Introduction

Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use.